Issued Patents All Time
Showing 76–100 of 213 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985143 | Micro assembled LED displays and lighting elements | Christopher Bower, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru +1 more | 2021-04-20 |
| 10964583 | Micro-transfer-printable flip-chip structures and methods | Christopher Bower, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte | 2021-03-30 |
| 10944027 | Pixel modules with controllers and light emitters | Christopher Bower, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson +1 more | 2021-03-09 |
| 10943931 | Wafers with etchable sacrificial patterns, anchors, tethers, and printable devices | Christopher Bower, Etienne Menard, Joseph Carr | 2021-03-09 |
| 10937679 | High-precision printed structures | Ronald S. Cok, David Gomez, Tanya Yvette Moore, Christopher Bower | 2021-03-02 |
| 10930623 | Micro-transfer printable electronic component | Ronald S. Cok, Christopher Bower, Carl Prevatte | 2021-02-23 |
| 10917953 | Electrically parallel fused LEDs | Ronald S. Cok, Christopher Bower | 2021-02-09 |
| 10833225 | Micro assembled LED displays and lighting elements | Christopher Bower, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru +1 more | 2020-11-10 |
| 10832935 | Multi-level micro-device tethers | Christopher Bower, Salvatore Bonafede, Brook Raymond, Carl Prevatte | 2020-11-10 |
| 10796971 | Pressure-activated electrical interconnection with additive repair | Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Bower, Carl Prevatte +1 more | 2020-10-06 |
| 10796938 | Micro-transfer printing with selective component removal | Erich Radauscher, Ronald S. Cok, Christopher Bower, James O. Thostenson | 2020-10-06 |
| 10782002 | LED optical components | Christopher Bower, Ronald S. Cok, Brent Fisher | 2020-09-22 |
| 10777521 | Printable component structure with electrical contact | Christopher Bower, Ronald S. Cok | 2020-09-15 |
| 10749093 | Interconnection by lateral transfer printing | Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Bower +1 more | 2020-08-18 |
| 10748793 | Printing component arrays with different orientations | Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Christopher Bower, Ronald S. Cok | 2020-08-18 |
| 10714374 | High-precision printed structures | Ronald S. Cok, David Gomez, Tanya Yvette Moore, Christopher Bower | 2020-07-14 |
| 10714001 | Micro-light-emitting-diode displays | Ronald S. Cok, Christopher Bower | 2020-07-14 |
| 10690920 | Displays with transparent bezels | Ronald S. Cok, Christopher Bower, Brook Raymond, Erich Radauscher | 2020-06-23 |
| 10620277 | Magnetic field sensor and method for making same | Christian Schott, Christopher Bower | 2020-04-14 |
| 10600671 | Micro-transfer-printable flip-chip structures and methods | Christopher Bower, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte | 2020-03-24 |
| 10593827 | Device source wafers with patterned dissociation interfaces | Brook Raymond, Christopher Bower, Ronald S. Cok | 2020-03-17 |
| 10573544 | Micro-transfer printing with selective component removal | Erich Radauscher, Ronald S. Cok, Christopher Bower | 2020-02-25 |
| 10522575 | Methods of making printable device wafers with sacrificial layers | Christopher Bower, Etienne Menard, Joseph Carr | 2019-12-31 |
| 10522710 | Printable inorganic semiconductor structures | Christopher Bower, David Gomez, Carl Prevatte, Salvatore Bonafede | 2019-12-31 |
| 10510937 | Interconnection by lateral transfer printing | Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Bower +1 more | 2019-12-17 |