Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12151494 | Micro-transfer printing stamps and components | David Gomez, Christopher Bower, Matthew Meitl, Salvatore Bonafede | 2024-11-26 |
| 11850874 | Micro-transfer printing stamps and components | David Gomez, Christopher Bower, Matthew Meitl, Salvatore Bonafede | 2023-12-26 |
| 11318663 | Multi-layer stamp | Ronald S. Cok, David Gomez | 2022-05-03 |
| 11062936 | Transfer stamps with multiple separate pedestals | David Gomez | 2021-07-13 |
| 11024608 | Structures and methods for electrical connection of micro-devices and substrates | Matthew Meitl, Brook Raymond, Ronald S. Cok, Christopher Bower, Salvatore Bonafede +3 more | 2021-06-01 |
| 10937679 | High-precision printed structures | Ronald S. Cok, David Gomez, Matthew Meitl, Christopher Bower | 2021-03-02 |
| 10899067 | Multi-layer stamp | Ronald S. Cok, David Gomez | 2021-01-26 |
| 10749093 | Interconnection by lateral transfer printing | Matthew Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Bower +1 more | 2020-08-18 |
| 10714374 | High-precision printed structures | Ronald S. Cok, David Gomez, Matthew Meitl, Christopher Bower | 2020-07-14 |
| 10510937 | Interconnection by lateral transfer printing | Matthew Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Bower +1 more | 2019-12-17 |