| 12249532 |
Multi-level micro-device tethers |
Christopher Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond |
2025-03-11 |
| 12080690 |
Micro assembled LED displays and lighting elements |
Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg +1 more |
2024-09-03 |
| 12074583 |
Printing components to adhesive substrate posts |
Matthew Meitl, Christopher Bower, Salvatore Bonafede, Ronald S. Cok, Brook Raymond |
2024-08-27 |
| 11990438 |
Chiplets with connection posts |
Christopher Bower, Ronald S. Cok, Matthew Meitl |
2024-05-21 |
| 11854788 |
Micro assembled LED displays and lighting elements |
Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg +1 more |
2023-12-26 |
| 11670533 |
Multi-level micro-device tethers |
Christopher Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond |
2023-06-06 |
| 11552034 |
Chiplets with connection posts |
Christopher Bower, Ronald S. Cok, Matthew Meitl |
2023-01-10 |
| 11495560 |
Chiplets with connection posts |
Christopher Bower, Ronald S. Cok, Matthew Meitl |
2022-11-08 |
| 11393730 |
Pressure-activated electrical interconnection with additive repair |
Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Bower, Matthew Meitl +1 more |
2022-07-19 |
| 11387153 |
Pressure-activated electrical interconnection with additive repair |
Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Bower, Matthew Meitl +1 more |
2022-07-12 |
| 11374086 |
Devices with a single metal layer |
Christopher Bower, Matthew Meitl, Ronald S. Cok |
2022-06-28 |
| 11276657 |
Chiplets with connection posts |
Christopher Bower, Ronald S. Cok, Matthew Meitl |
2022-03-15 |
| 11127812 |
Devices with a single metal layer |
Christopher Bower, Matthew Meitl, Ronald S. Cok |
2021-09-21 |
| 11024608 |
Structures and methods for electrical connection of micro-devices and substrates |
Matthew Meitl, Brook Raymond, Ronald S. Cok, Christopher Bower, Salvatore Bonafede +3 more |
2021-06-01 |
| 10985143 |
Micro assembled LED displays and lighting elements |
Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg +1 more |
2021-04-20 |
| 10964583 |
Micro-transfer-printable flip-chip structures and methods |
Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond |
2021-03-30 |
| 10930623 |
Micro-transfer printable electronic component |
Ronald S. Cok, Christopher Bower, Matthew Meitl |
2021-02-23 |
| 10833225 |
Micro assembled LED displays and lighting elements |
Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg +1 more |
2020-11-10 |
| 10832935 |
Multi-level micro-device tethers |
Christopher Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond |
2020-11-10 |
| 10796971 |
Pressure-activated electrical interconnection with additive repair |
Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Bower, Matthew Meitl +1 more |
2020-10-06 |
| 10749093 |
Interconnection by lateral transfer printing |
Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond +1 more |
2020-08-18 |
| 10600671 |
Micro-transfer-printable flip-chip structures and methods |
Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond |
2020-03-24 |
| 10522710 |
Printable inorganic semiconductor structures |
Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede |
2019-12-31 |
| 10510937 |
Interconnection by lateral transfer printing |
Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond +1 more |
2019-12-17 |
| 10475876 |
Devices with a single metal layer |
Christopher Bower, Matthew Meitl, Ronald S. Cok |
2019-11-12 |