Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7705464 | Connection structure for semiconductor devices | Jhon Jhy Liaw, Wesley Lin, Chii-Ming Wu, Ren-Fen Tsui | 2010-04-27 |
| 6396751 | Semiconductor device comprising a test structure | Yih-Yuh Doong, Tsu-bin Shen, Chien-Jung Wang | 2002-05-28 |
| 6228753 | Method of fabricating a bonding pad structure for improving the bonding pad surface quality | Yung-Tsun Lo, Wen-Yu Ho | 2001-05-08 |
| 6150235 | Method of forming shallow trench isolation structures | Yih-Yuh Doong, Tsu-bin Shen, Ching-Hsiang Hsu | 2000-11-21 |
| 6096645 | Method of making IC devices having stable CVD titanium nitride films | Yung-Tsun Lo, Hui Chen, Wen-Yu Ho, Feng-hsien Chao | 2000-08-01 |
| 6022800 | Method of forming barrier layer for tungsten plugs in interlayer dielectrics | Wen-Yu Ho, Sen-Nan Lee, Hui Chen | 2000-02-08 |