Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5710077 | Method for the generation of stacking-fault-induced damage on the back of semiconductor wafers | Rudolf Mayrhuber, Johann Niedermeier | 1998-01-20 |
| 5164323 | Process for the surface treatment of semiconductor slices | Helene Prigge, Reinhold Wahlich | 1992-11-17 |
| 5030910 | Method and apparatus for slicing crystalline wafers aided by magnetic field monitoring means | Joachim Junge, Johann Glas, Johann Niedermeier | 1991-07-09 |
| 4973563 | Process for preserving the surface of silicon wafers | Helene Prigge, Anton Schnegg | 1990-11-27 |
| 4971654 | Process and apparatus for etching semiconductor surfaces | Anton Schnegg, Helene Prigge, Robert Rurlander, Fritz Ketterl | 1990-11-20 |
| 4968381 | Method of haze-free polishing for semiconductor wafers | Helene Prigge, Anton Schnegg, Herbert Jacob | 1990-11-06 |
| 4900363 | Method and liquid preparation for removing residues of auxiliary sawing materials from wafers | Manuela Knipf, Rudolf Mayrhuber, Jurgen Schuhmacher, Max Stadler | 1990-02-13 |
| 4844047 | Process for sawing crystal rods or blocks into thin wafers | Karlheinz Langsdorf, Johann Niedermeier, Johann Glas | 1989-07-04 |
| 4811722 | Process for sharpening cutting-off tools and cutting-off process | Johann Niedermeier | 1989-03-14 |
| 4739589 | Process and apparatus for abrasive machining of a wafer-like workpiece | Ingo Haller, Otto Rothenaicher, Karl-Heinz Langsdorf | 1988-04-26 |