Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6250541 | Method of forming interconnections on electronic modules | Dongkai Shangguan, Achyuta Achari | 2001-06-26 |
| 6248247 | Method of fortifying an air bridge circuit | Lakhi Nandlal Goenka | 2001-06-19 |
| 6217783 | Method for strengthening air bridge circuits | Lakhi Nandlal Goenka | 2001-04-17 |
| 6168725 | Etching of Al-Cu layers to form electronic circuits using base solutions including nitrites, borates or bromates | Achyuta Achari | 2001-01-02 |
| 6144104 | High-operating-temperature electronic component | Jay DeAvis Baker, Prathap Amerwai Reddy, Vivek Amir Jairazbhoy | 2000-11-07 |
| 6082610 | Method of forming interconnections on electronic modules | Dongkai Shangguan, Achyuta Achari | 2000-07-04 |
| 6027575 | Metallic adhesive for forming electronic interconnects at low temperatures | Dongkai Shangguan | 2000-02-22 |
| 6011313 | Flip chip interconnections on electronic modules | Dongkai Shangguan, Achyuta Achari | 2000-01-04 |
| 5964395 | Predeposited transient phase electronic interconnect media | Andrew Z. Glovatsky | 1999-10-12 |
| 5928404 | Electrical solder and method of manufacturing | Dongkai Shangguan | 1999-07-27 |
| 5894054 | Aluminum components coated with zinc-antimony alloy for manufacturing assemblies by CAB brazing | Dongkai Shangguan | 1999-04-13 |
| 5871690 | Low-temperature solder compositions | Achyuta Achari, Dongkai Shangguan | 1999-02-16 |
| 5863493 | Lead-free solder compositions | Achyuta Achari, Dongkai Shangguan | 1999-01-26 |
| 5833921 | Lead-free, low-temperature solder compositions | Dongkai Shangguan | 1998-11-10 |
| 5755896 | Low temperature lead-free solder compositions | Dongkai Shangguan | 1998-05-26 |