Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5964395 | Predeposited transient phase electronic interconnect media | Mohan R. Paruchuri | 1999-10-12 |
| 5938455 | Three-dimensional molded circuit board having interlocking connections | Michael George Todd, Peter Joseph Sinkunas, Myron Lemecha | 1999-08-17 |
| 5929375 | EMI protection and CTE control of three-dimensional circuitized substrates | Michael George Todd, Richard Keith McMillan | 1999-07-27 |
| 5920462 | Heat spreader mounting pad configurations for laser soldering | Jay DeAvis Baker, Peter Joseph Sinkunas | 1999-07-06 |
| 5917704 | Laser-solderable electronic component | John Trublowski, Richard Keith McMillan, Bernard A. Meyer | 1999-06-29 |
| 5914534 | Three-dimensional multi-layer molded electronic device and method for manufacturing same | Michael George Todd, Peter Joseph Sinkunas | 1999-06-22 |
| 5882954 | Method for adhering a metallization to a substrate | Ram S. Raghava, Jay DeAvis Baker, Michael George Todd | 1999-03-16 |
| 5878661 | Self-shearing stencil | Vivek Amir Jairazbhoy, Jeff Lin, John Trublowski | 1999-03-09 |
| 5878487 | Method of supporting an electrical circuit on an electrically insulative base substrate | Richard Keith McMillan, Michael George Todd | 1999-03-09 |
| 5837609 | Fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part | Michael George Todd, Robert Edward Belke | 1998-11-17 |
| 5754398 | Circuit-carrying automotive component and method of manufacturing the same | Alice Dawn Zitzmann | 1998-05-19 |
| 5752851 | Circuit clip connector | Victor Zaderej, Michael George Todd, Peter Joseph Sinkunas | 1998-05-19 |
| 5743457 | Controlled zone solder dispensing | Walter Benedette, Medhat Said | 1998-04-28 |
| 5738797 | Three-dimensional multi-layer circuit structure and method for forming the same | Robert Edward Belke, Michael George Todd, Alice Dawn Zitzmann | 1998-04-14 |
| 5715140 | Overlay substrate for securing electronic devices in a vehicle | Peter Joseph Sinkunas, Michael George Todd, Myron Lemecha | 1998-02-03 |
| 5706170 | Ventilation duct with integrated electronics enclosure | Michael George Todd, Peter Joseph Sinkunas | 1998-01-06 |
| 5702584 | Enhanced plating adhesion through the use of metallized fillers in plastic substrate | Lakhi Nandlal Goenka, Michael George Todd | 1997-12-30 |
| 5685475 | Apparatus for cooling printed circuit boards in wave soldering | Vivek Amir Jairazbhoy, Timothy J. Yerdon | 1997-11-11 |
| 5600181 | Hermetically sealed high density multi-chip package | Patrick M. Scott, Michael A. Mele | 1997-02-04 |
| 5577657 | Method of improved oven reflow soldering | — | 1996-11-26 |
| 5407865 | Method of manufacturing a flexible metallized polymer film cover for environmental protection of electronic assemblies | Michael A. Mele, Patrick M. Scott | 1995-04-18 |
| 5318855 | Electronic assembly with flexible film cover for providing electrical and environmental protection | Michael A. Mele, Patrick M. Scott | 1994-06-07 |
| 5102028 | Localized soldering station using state changing medium | Robert J. Lynch, James G. Motto, Jr., Steve A. Repchak, Jean M. Vittone, Lawrence R. Yetter | 1992-04-07 |