Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5600181 | Hermetically sealed high density multi-chip package | Patrick M. Scott, Andrew Z. Glovatsky | 1997-02-04 |
| 5407865 | Method of manufacturing a flexible metallized polymer film cover for environmental protection of electronic assemblies | Andrew Z. Glovatsky, Patrick M. Scott | 1995-04-18 |
| 5318855 | Electronic assembly with flexible film cover for providing electrical and environmental protection | Andrew Z. Glovatsky, Patrick M. Scott | 1994-06-07 |