Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884634 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2011-02-08 |
| 7872482 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2011-01-18 |
| 7382142 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2008-06-03 |
| 5556507 | Multifunctional contactless interconnect technology | Dominic Massetti | 1996-09-17 |
| 5173439 | Forming wide dielectric-filled isolation trenches in semi-conductors | Somanath Dash, Michael L. Kerbaugh, Charles W. Koburger, III, Brian J. Machesney | 1992-12-22 |