Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6499648 | Method and device for making a metal bump with an increased height | Wen-Lo Shieh, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang, Feng-Chang Tu +4 more | 2002-12-31 |
| 6390356 | Method of forming cylindrical bumps on a substrate for integrated circuits | Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Chia-Chieh Hu, Hui-Pin Chen +4 more | 2002-05-21 |
| 6358834 | Method of forming bumps on wafers or substrates | Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Hsuan-Jui Chang, Hui-Pin Chen +4 more | 2002-03-19 |
| 6284956 | Plant selectable marker and plant transformation method | Raymond L. Rodriguez | 2001-09-04 |
| 6274491 | Process of manufacturing thin ball grid array substrates | Wan Le Xie, Fu-Yu Huang, Yung-Cheng Chuang, Chung-Ming Chang, Hui-Pin Chen +4 more | 2001-08-14 |