Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12281369 | Extra thick hot rolled h section steel and production method therefor | Meng Xia, Baoqiao Wu, Meizhuang Wu, Jun Xing, Jie Wang +6 more | 2025-04-22 |
| 11869726 | Stacked aluminum electrolytic capacitor and method for manufacturing the same | Shiau Hong Wu, Chung-Ming Wu | 2024-01-09 |
| 10665729 | Solar cell module and method for manufacturing the same technical field | Yujun Zhang, Zhenlin Dai, Zhengtong Wu, Songkun Yu, Qiang Huang +1 more | 2020-05-26 |
| 6567270 | Semiconductor chip package with cooling arrangement | Wen-Lo Shieh, Ning Huang, Hua-Wen Chiang, Chung-Ming Chang, Feng-Chang Tu +4 more | 2003-05-20 |
| 6499648 | Method and device for making a metal bump with an increased height | Wen-Lo Shieh, Ning Huang, Hua-Wen Chiang, Chung-Ming Chang, Feng-Chang Tu +4 more | 2002-12-31 |
| 6390356 | Method of forming cylindrical bumps on a substrate for integrated circuits | Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Chia-Chieh Hu, Ning Huang +4 more | 2002-05-21 |
| 6358834 | Method of forming bumps on wafers or substrates | Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Hsuan-Jui Chang, Ning Huang +4 more | 2002-03-19 |
| 6274491 | Process of manufacturing thin ball grid array substrates | Wan Le Xie, Fu-Yu Huang, Yung-Cheng Chuang, Ning Huang, Chung-Ming Chang +4 more | 2001-08-14 |