Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424760 | Antenna | Nai-Chen Liu, Shih-Huang Yeh, Chung-Hsin Chiang, Wun-Jian Lin | 2025-09-23 |
| 12272888 | Electronic device and antenna feeding module | Yun-Tsan Lee, Chia-Hao Chang | 2025-04-08 |
| 12212060 | Electronic device and antenna module | Hsieh-Chih Lin, Guan-Ren SU | 2025-01-28 |
| 11769939 | Electronic device and antenna structure | Hsieh-Chih Lin, Guan-Ren SU, Wei-Shan Chang, Yi-Feng Wu, Shang-Sian You | 2023-09-26 |
| 10866920 | Method and device for adjusting signal transmission direction in bidirectional ReDriver IC chip | Yu-Lung Lin | 2020-12-15 |
| 10074892 | Communication device with metal-frame half-loop antenna element | Kin-Lu Wong | 2018-09-11 |
| 9980018 | Communication device with narrow-ground-clearance antenna element | Kin-Lu Wong | 2018-05-22 |
| 9853351 | Communication device with metal-frame half-loop antenna element | Kin-Lu Wong | 2017-12-26 |
| 9325066 | Communication device and method for designing antenna element thereof | Kin-Lu Wong, Wei-Yu Li, Chun-Yih Wu | 2016-04-26 |
| 9178274 | Communication device and antenna element therein | Kin-Lu Wong | 2015-11-03 |
| 9124001 | Communication device and antenna element therein | Kin-Lu Wong | 2015-09-01 |
| 6567270 | Semiconductor chip package with cooling arrangement | Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang +4 more | 2003-05-20 |
| 6499648 | Method and device for making a metal bump with an increased height | Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang +4 more | 2002-12-31 |
| 6390356 | Method of forming cylindrical bumps on a substrate for integrated circuits | Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Chia-Chieh Hu, Hui-Pin Chen +4 more | 2002-05-21 |
| 6358834 | Method of forming bumps on wafers or substrates | Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Hui-Pin Chen, Ning Huang +4 more | 2002-03-19 |
| 6274491 | Process of manufacturing thin ball grid array substrates | Wan Le Xie, Fu-Yu Huang, Yung-Cheng Chuang, Ning Huang, Chung-Ming Chang +4 more | 2001-08-14 |