Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952153 | Differential pressure sensing device and fabricating method therefor | Jung-Tai Chen, Chun-Hsun Chu | 2011-05-31 |
| 6600216 | Structure of a pin platform for integrated circuit | Chia-Ming Yang, Chen-Fa Tsai, Shu-Fen Liang, Shu-Min Chou | 2003-07-29 |
| 6567270 | Semiconductor chip package with cooling arrangement | Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang, Feng-Chang Tu +4 more | 2003-05-20 |
| 6499648 | Method and device for making a metal bump with an increased height | Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang, Feng-Chang Tu +4 more | 2002-12-31 |
| 6390356 | Method of forming cylindrical bumps on a substrate for integrated circuits | Fu-Yu Huang, Yung-Cheng Chuang, Chia-Chieh Hu, Hui-Pin Chen, Ning Huang +4 more | 2002-05-21 |
| 6358834 | Method of forming bumps on wafers or substrates | Fu-Yu Huang, Yung-Cheng Chuang, Hsuan-Jui Chang, Hui-Pin Chen, Ning Huang +4 more | 2002-03-19 |