Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553502 | Two etch method for achieving a wafer thickness profile | Laura Mauer, John Taddei, John Clark, Elena Lawrence, Eric Kurt Zwirnmann +1 more | 2020-02-04 |
| 10503182 | Apparatus and method for metals free reduction and control of resistivity of deionized water | John Taddei | 2019-12-10 |
| 10294132 | Apparatus and method to reduce and control resistivity of deionized water | John Taddei | 2019-05-21 |
| 10026660 | Method of etching the back of a wafer to expose TSVs | Laura Mauer, John Taddei, John Clark, Elena Lawrence, Eric Kurt Zwirnmann +1 more | 2018-07-17 |
| 9870928 | System and method for updating an arm scan profile through a graphical user interface | David Goldberg | 2018-01-16 |