Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553502 | Two etch method for achieving a wafer thickness profile | Laura Mauer, John Taddei, John Clark, Elena Lawrence, David Goldberg +1 more | 2020-02-04 |
| 10446387 | Apparatus and method to control etch rate through adaptive spiking of chemistry | Laura Mauer, John Taddei, James Swallow, David Goldberg | 2019-10-15 |
| 10026660 | Method of etching the back of a wafer to expose TSVs | Laura Mauer, John Taddei, John Clark, Elena Lawrence, David Goldberg +1 more | 2018-07-17 |