Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069583 | Apparatus and method for the minimization of undercut during a UBM etch process | John Taddei, David Goldberg, Ian Cochran, Christopher Orlando, James Swallow +1 more | 2021-07-20 |
| 11004755 | Apparatus and method for the minimization of undercut during a UBM etch process | John Taddei, David Goldberg, Ian Cochran, Christopher Orlando, James Swallow | 2021-05-11 |
| 10553502 | Two etch method for achieving a wafer thickness profile | Laura Mauer, John Taddei, John Clark, Eric Kurt Zwirnmann, David Goldberg +1 more | 2020-02-04 |
| 10026660 | Method of etching the back of a wafer to expose TSVs | Laura Mauer, John Taddei, John Clark, Eric Kurt Zwirnmann, David Goldberg +1 more | 2018-07-17 |
| 9698062 | System and method for performing a wet etching process | Laura Mauer, John Taddei, Ramey Youssef | 2017-07-04 |
| 9541837 | Apparatus and method for removing challenging polymer films and structures from semiconductor wafers | John Taddei, Laura Mauer, Ramey Youssef, John Clark | 2017-01-10 |