| 11069583 |
Apparatus and method for the minimization of undercut during a UBM etch process |
John Taddei, David Goldberg, Ian Cochran, Christopher Orlando, James Swallow +1 more |
2021-07-20 |
| 11004755 |
Apparatus and method for the minimization of undercut during a UBM etch process |
John Taddei, David Goldberg, Ian Cochran, Christopher Orlando, James Swallow |
2021-05-11 |
| 10553502 |
Two etch method for achieving a wafer thickness profile |
Laura Mauer, John Taddei, John Clark, Eric Kurt Zwirnmann, David Goldberg +1 more |
2020-02-04 |
| 10026660 |
Method of etching the back of a wafer to expose TSVs |
Laura Mauer, John Taddei, John Clark, Eric Kurt Zwirnmann, David Goldberg +1 more |
2018-07-17 |
| 9698062 |
System and method for performing a wet etching process |
Laura Mauer, John Taddei, Ramey Youssef |
2017-07-04 |
| 9541837 |
Apparatus and method for removing challenging polymer films and structures from semiconductor wafers |
John Taddei, Laura Mauer, Ramey Youssef, John Clark |
2017-01-10 |