Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5252515 | Method for field inversion free multiple layer metallurgy VLSI processing | Lih-Shyng Tsai, Jiunn-Jyi Lin, Shu-Lan Ying | 1993-10-12 |
| 5248384 | Rapid thermal treatment to eliminate metal void formation in VLSI manufacturing process | Lih-Shyng Tsai, Jiunn-Jyi Lin, Chin-Twan Wei | 1993-09-28 |