Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8063470 | Method and apparatus for no lead semiconductor package | Saravuth Sirinorakul | 2011-11-22 |
| 8013437 | Package with heat transfer | Saravuth Sirinorakul | 2011-09-06 |
| 7922877 | Method and apparatus for plating a semiconductor package | Chalermsak Sumithpibul, Apichart Phaowongsa | 2011-04-12 |
| 7790512 | Molded leadframe substrate semiconductor package | Saravuth Sirinorakul | 2010-09-07 |
| 7718522 | Method and apparatus for plating a semiconductor package | Chalermsak Sumithpibul, Apichart Phaowongsa | 2010-05-18 |
| 7572168 | Method and apparatus for high speed singulation | Apichart Phaowongsa, Charun Sae-Lee, Praphan Sararat | 2009-08-11 |
| 7327017 | Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound | Saravuth Sirinorakul, Arlene V. Layson, Yee Heong Chua | 2008-02-05 |
| 7205180 | Process of fabricating semiconductor packages using leadframes roughened with chemical etchant | Saravuth Sirinorakul, Arlene V. Layson, Yee Heong Chua | 2007-04-17 |
| 7153724 | Method of fabricating no-lead package for semiconductor die with half-etched leadframe | Saravuth Sirinorakul, Sitta Jewjaitham, Yee Heong Chua | 2006-12-26 |
| 7060535 | Flat no-lead semiconductor die package including stud terminals | Saravuth Sirinorakul, Sitta Jewjaitham | 2006-06-13 |