Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199228 | Manufacturing method of metal gate structure | Nien-Ting Ho, Chien-Hao Chen, Hsin-Fu Huang, Chi-Yuan Sun, Wei-Yu Chen +2 more | 2019-02-05 |
| 10043811 | Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same | Chih-Chieh Tsai, Pin-Hong Chen, Tzu-Chieh Chen, Yi-Wei Chen, Hsin-Fu Huang +2 more | 2018-08-07 |
| 9953982 | Semiconductor device and method for fabricating the same | Pin-Hong Chen, Chih-Chieh Tsai, Tzu-Chieh Chen, Kai-Jiun Chang, Chia-Chen Wu +2 more | 2018-04-24 |
| 9859123 | Method for fabricating semiconductor device | Chia-Chen Wu, Pin-Hong Chen, Kai-Jiun Chang, Yi-An Huang, Chih-Chieh Tsai +2 more | 2018-01-02 |
| 9773789 | Dynamic random access memory device | Yi-Wei Chen, Chih-Chieh Tsai, Kai-Jiun Chang | 2017-09-26 |
| 9754943 | Dynamic random access memory device | Kai-Jiun Chang, Yi-Wei Chen, Chih-Chieh Tsai, Wei-Hsin Liu, Jui-Min Lee +1 more | 2017-09-05 |
| 9653300 | Structure of metal gate structure and manufacturing method of the same | Nien-Ting Ho, Chien-Hao Chen, Hsin-Fu Huang, Chi-Yuan Sun, Wei-Yu Chen +2 more | 2017-05-16 |
| 9548268 | Semiconductor device having bilayer metal layer | Chun-Chi Huang, Yung-Hung Yen, Hsin-Hsing Chen, Chih-Yueh Li | 2017-01-17 |
| 9416459 | Electrical chemical plating process | Chun-Ling Lin, Yen-Liang Lu, Chi-Mao Hsu, Chin-Fu Lin, Chun-Hung Chen +1 more | 2016-08-16 |
| 9412653 | Through silicon via (TSV) process | Jia-Jia Chen, Chi-Mao Hsu, Chun-Ling Lin, Huei-Ru Tsai, Ching-Wei Hsu +2 more | 2016-08-09 |
| 9281374 | Metal gate structure and fabrication method thereof | Min-Chuan Tsai, Chih-Chien Liu, Jen-Chieh Lin, Pei-Ying Li, Shao-Wei Wang +2 more | 2016-03-08 |
| 9136170 | Through silicon via (TSV) structure and process thereof | Jia-Jia Chen, Chi-Mao Hsu, Chun-Ling Lin, Huei-Ru Tsai, Ching-Wei Hsu +2 more | 2015-09-15 |
| 9076784 | Transistor and semiconductor structure | Min-Chuan Tsai, Hsin-Fu Huang, Chi-Mao Hsu, Chin-Fu Lin, Chien-Hao Chen +3 more | 2015-07-07 |
| 9012324 | Through silicon via process | Jia-Jia Chen, Chi-Mao Hsu, Ching-Wei Hsu, Szu-Hao Lai, Huei-Ru Tsai +3 more | 2015-04-21 |
| 8872286 | Metal gate structure and fabrication method thereof | Min-Chuan Tsai, Chih-Chien Liu, Jen-Chieh Lin, Pei-Ying Li, Shao-Wei Wang +2 more | 2014-10-28 |
| 8836049 | Semiconductor structure and process thereof | Min-Chuan Tsai, Hsin-Fu Huang, Chi-Mao Hsu, Chin-Fu Lin, Chien-Hao Chen +3 more | 2014-09-16 |
| 8735269 | Method for forming semiconductor structure having TiN layer | Chi-Yuan Sun, Chien-Hao Chen, Hsin-Fu Huang, Min-Chuan Tsai, Wei-Yu Chen +2 more | 2014-05-27 |
| 8481425 | Method for fabricating through-silicon via structure | Yen-Liang Lu, Chun-Ling Lin, Chi-Mao Hsu, Chin-Fu Lin, Chun-Hung Chen +1 more | 2013-07-09 |
| 8420544 | Method for fabricating interconnection structure with dry-cleaning process | Hsin-Fu Huang, Chi-Mao Hsu, Chin-Fu Lin | 2013-04-16 |