Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6325662 | Apparatus for testing IC chips using a sliding springy mechanism which exerts a nearly constant force apparatus | — | 2001-12-04 |
| 6307391 | Pivoting springy mechanism that opens and closes pressed electrical contacts with a force which is nearly constant over a range of closed positions | James Mason Brafford | 2001-10-23 |
| 6307388 | Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed together | Lawrence William Friedrich, James Mason Brafford, James Wittman Babcock | 2001-10-23 |
| 6243944 | Residue-free method of assembling and disassembling a pressed joint with low thermal resistance | James Wittman Babcock | 2001-06-12 |
| 6196299 | Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its corners | James Wittman Babcock, Lawrence William Friedrich | 2001-03-06 |
| 6179047 | Mechanical assembly for regulating the temperature of an electronic device which incorporates at least two leaf springs for self-alignment plus a low initial contact force and a low profile | James Wittman Babcock | 2001-01-30 |
| 6116331 | Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile | James Wittman Babcock, Richard Leigh Bumann | 2000-09-12 |
| 6108208 | Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules | James Wittman Babcock | 2000-08-22 |
| 6074219 | Electromechanical subassembly including a carrier with springy contacts that exert large and small contact forces | Leonard Harry Alton | 2000-06-13 |
| 6042388 | Electromechanical module having a thin springy plate for establishing pressed electrical connections | Leonard Harry Alton | 2000-03-28 |
| 5967798 | Integrated circuit module having springy contacts of at least two different types for reduced stress | Leonard Harry Alton | 1999-10-19 |
| 5918665 | Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested | James Wittman Babcock | 1999-07-06 |
| 5844208 | Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature | James Wittman Babcock | 1998-12-01 |
| 5821505 | Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink | James Wittman Babcock | 1998-10-13 |
| 5579205 | Electromechanical module with post-solder attachable/removable heat sink frame and low profile | Stephen A. Smiley | 1996-11-26 |
| 5441195 | Method of stretching solder joints | Maria Del Carmen Alvarez, Steve Joseph Bezuk, Robert E. Rackerby, Patrick A. Weber | 1995-08-15 |
| 5424580 | Electro-mechanical assembly of high power and low power IC packages with a shared heat sink | Stephen A. Smiley | 1995-06-13 |
| 5307239 | Electromechanical module with small footprint and post-solder attachable/removable heat sink frame | Paul McCarty, Jon Zimmerman | 1994-04-26 |
| 5019943 | High density chip stack having a zigzag-shaped face which accommodates connections between chips | Charles J. Fassbender, Harshadrai Vora | 1991-05-28 |
| 4893499 | Method and apparatus for detecting leaks in IC packages by sensing package deflections | Wilbur T. Layton, Dale L. Robinson | 1990-01-16 |
| 4879629 | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation | Kyle Halkola | 1989-11-07 |
| 4809134 | Low stress liquid cooling assembly | James H. Rogneby | 1989-02-28 |
| 4807019 | Cavity-up-cavity-down multichip integrated circuit package | — | 1989-02-21 |
| 4721996 | Spring loaded module for cooling integrated circuit packages directly with a liquid | Kyle Halkola | 1988-01-26 |
| 4698728 | Leak tolerant liquid cooling system | Kyle Halkola | 1987-10-06 |