Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5530287 | High density wire bond pattern for integratd circuit package | Thomas P. Currie | 1996-06-25 |
| 4809134 | Low stress liquid cooling assembly | Jerry Ihor Tustaniwskyj | 1989-02-28 |