Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6651322 | Method of reworking a multilayer printed circuit board assembly | — | 2003-11-25 |
| 6443739 | LGA compression contact repair system | — | 2002-09-03 |
| 5530287 | High density wire bond pattern for integratd circuit package | James H. Rogneby | 1996-06-25 |
| 5290970 | Multilayer printed circuit board rework method and rework pin | — | 1994-03-01 |
| 5162974 | Heat sink assembly for cooling electronic components | — | 1992-11-10 |
| 4561006 | Integrated circuit package with integral heating circuit | — | 1985-12-24 |
| 4504156 | Cooling system monitor assembly and method | Terry B. Zbinden | 1985-03-12 |
| 4446477 | Multichip thin film module | Norman Goldberg | 1984-05-01 |
| 4310811 | Reworkable multi-layer printed circuit board | — | 1982-01-12 |