Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5579205 | Electromechanical module with post-solder attachable/removable heat sink frame and low profile | Jerry Ihor Tustaniwskyj | 1996-11-26 |
| 5424580 | Electro-mechanical assembly of high power and low power IC packages with a shared heat sink | Jerry Ihor Tustaniwskyj | 1995-06-13 |
| 4611238 | Integrated circuit package incorporating low-stress omnidirectional heat sink | Terrence Evan Lewis, Rex Rice, Zeev Lipkes, John A. Nelson | 1986-09-09 |