Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5019943 | High density chip stack having a zigzag-shaped face which accommodates connections between chips | Charles J. Fassbender, Jerry Ihor Tustaniwskyj | 1991-05-28 |
| 4721831 | Module for packaging and electrically interconnecting integrated circuit chips on a porous substrate, and method of fabricating same | — | 1988-01-26 |