Issued Patents All Time
Showing 76–93 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6568267 | Sensing device and sensor apparatus | Kazumi Chida, Masato Hashimoto, Masaru Nagao, Hidemi Senda, Norihisa Okayama +1 more | 2003-05-27 |
| 5929385 | AC oxide superconductor wire and cable | Akio Kimura, Masanao Mimura, Hideo Ishii, Shoichi Honjo, Yoshihiro Iwata | 1999-07-27 |
| 5096749 | Method of producing a metallization layer structure | Shigeki Harada | 1992-03-17 |
| 5081067 | Ceramic package type semiconductor device and method of assembling the same | Nobutaka Shimizu, Takehisa Tsujimura, Shigeki Harada | 1992-01-14 |
| 5065223 | Packaged semiconductor device | Hirohisa Matsuki, Shigeki Harada, Toshiki Yoshida | 1991-11-12 |
| 5055914 | Ceramic package type semiconductor device and method of assembling the same | Nobutaka Shimizu, Takehisa Tsujimura, Shigeki Harada | 1991-10-08 |
| 4980239 | Metallization layer structure formed on aluminum nitride ceramics and method of producing the metallization layer structure | Shigeki Harada | 1990-12-25 |
| 4891344 | Low dielectric constant ceramic substrate | Yasumasa Wakasugi | 1990-01-02 |
| 4875087 | Integrated circuit device having strip line structure therein | Akira Miyauchi, Hiroshi Nishimoto, Tadashi Okiyama, Hiroo Kitasagami, Haruo Tamada +1 more | 1989-10-17 |
| 4827327 | Integrated circuit device having stacked conductive layers connecting circuit elements therethrough | Akira Miyauchi, Hiroshi Nishimoto, Tadashi Okiyama, Hiroo Kitasagami, Haruo Tamada +1 more | 1989-05-02 |
| 4803546 | Heatsink package for flip-chip IC | Yasumasa Wakasugi | 1989-02-07 |
| 4742024 | Semiconductor device and method of producing semiconductor device | Yasumasa Wakasugi, Shigeki Harada | 1988-05-03 |
| 4725878 | Semiconductor device | Akira Miyauchi, Hiroshi Nishimoto, Tadashi Okiyama, Hiroo Kitasagami, Haruo Tamada +1 more | 1988-02-16 |
| 4724472 | Semiconductor device | Tetsushi Wakabayashi, Kiyoshi Muratake | 1988-02-09 |
| 4698663 | Heatsink package for flip-chip IC | Yasumasa Wakasugi, Shigeki Harada | 1987-10-06 |
| 4688077 | Semiconductor device having radiator | Tetsushi Wakabayashi, Kiyoshi Muratake | 1987-08-18 |
| D276719 | Integrated circuit device | Hidehiko Akasaki, Tetsushi Wakabayashi | 1984-12-11 |
| 4426657 | Semiconductor device and method for producing same | Akira Abiru, Juro Inomata | 1984-01-17 |