Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10605771 | Electroplating solution analyzer and electroplating solution analysis method | Masahiro Kosugi | 2020-03-31 |
| 10557819 | Electrolytic copper plating solution analyzer, and electrolytic copper plating solution analysis method | Masahiro Kosugi | 2020-02-11 |
| 9883586 | Wiring substrate for bonding using solder having a low melting point and method for manufacturing same | Tetsuyuki TSUCHIDA, Ikuo Shohji, Akihiro HIRATA | 2018-01-30 |
| 9572252 | Wiring substrate and method of manufacturing wiring substrate | Tetsuyuki TSUCHIDA, Ikuo Shohji, Takahiro Kano | 2017-02-14 |
| 8440555 | Method for analyzing electrolytic copper plating solution | Katsuyoshi Naoi, Yuka Yamada | 2013-05-14 |
| 8203322 | DC-DC converter | Takae Shimada, Hiroyuki Shoji, Junpei Uruno | 2012-06-19 |
| 7936573 | Bi-directional DC-DC converter and control method | Tatsumi Yamauchi, Hiroyuki Shoji, Seigou Yukutake | 2011-05-03 |
| 7820535 | Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product | Katsuyoshi Naoi, Yuka Yamada | 2010-10-26 |
| 7692935 | Bi-directional DC-DC converter and control method | Tatsumi Yamauchi, Hiroyuki Shoji, Seigou Yukutake | 2010-04-06 |
| 6156218 | Method of pretreatment for electroless nickel plating | Yoshiyuki Hisumi | 2000-12-05 |
| 4614568 | High-speed silver plating and baths therefor | Yasuo Mori, Shunichi Kasai | 1986-09-30 |