Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9883586 | Wiring substrate for bonding using solder having a low melting point and method for manufacturing same | Tetsuyuki TSUCHIDA, Toshikazu Okubo, Akihiro HIRATA | 2018-01-30 |
| 9572252 | Wiring substrate and method of manufacturing wiring substrate | Tetsuyuki TSUCHIDA, Toshikazu Okubo, Takahiro Kano | 2017-02-14 |
| 7172643 | Lead-free solder powder material, lead-free solder paste and a method for preparing same | — | 2007-02-06 |
| 6569262 | Lead-free solder powder material, lead-free solder paste and a method for preparing same | — | 2003-05-27 |