Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12342473 | Wiring board and method of producing wiring board | Takeshi Tamura | 2025-06-24 |
| 11756846 | Glass core, multilayer circuit board, and method of manufacturing glass core | — | 2023-09-12 |
| 11516907 | Glass wiring board | — | 2022-11-29 |
| 10923439 | Core substrate, multi-layer wiring substrate, semiconductor package, semiconductor module, copper-clad substrate, and method for manufacturing core substrate | — | 2021-02-16 |
| 9883586 | Wiring substrate for bonding using solder having a low melting point and method for manufacturing same | Toshikazu Okubo, Ikuo Shohji, Akihiro HIRATA | 2018-01-30 |
| 9572252 | Wiring substrate and method of manufacturing wiring substrate | Toshikazu Okubo, Ikuo Shohji, Takahiro Kano | 2017-02-14 |