Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8440555 | Method for analyzing electrolytic copper plating solution | Toshikazu Okubo, Yuka Yamada | 2013-05-14 |
| 7820535 | Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product | Toshikazu Okubo, Yuka Yamada | 2010-10-26 |