Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5584647 | Object handling devices | Akira Uehara, Mitsuaki Minato | 1996-12-17 |
| 5254214 | Plasma taper etching for semiconductor device fabrication | Kazutoshi Fujisawa | 1993-10-19 |
| 5083896 | Object handling device | Akira Uehara, Mitsuaki Minato | 1992-01-28 |
| 5022979 | Electrode for use in the treatment of an object in a plasma | Akira Uehara, Mitsuo Samezawa | 1991-06-11 |
| 5006220 | Electrode for use in the treatment of an object in a plasma | Akira Uehara, Mitsuo Samezawa | 1991-04-09 |
| 4946537 | Plasma reactor | Akira Uehara | 1990-08-07 |
| 4900582 | Method for improving film quality of silica-based films | Muneo Nakayama, Akira Hashimoto, Toshihiro Nishimura, Eiichi Kashiwagi | 1990-02-13 |
| 4894254 | Method of forming silicone film | Muneo Nakayama, Akira Hashimoto, Toshihiro Nishimura, Akira Uehara | 1990-01-16 |
| 4868096 | Surface treatment of silicone-based coating films | Muneo Nakayama, Akira Uehara, Akira Hashimoto, Toshihiro Nishimura, Mitsuaki Minato +1 more | 1989-09-19 |
| 4749436 | Equipment for thermal stabilization process of photoresist pattern on semiconductor wafer | Mitsuaki Minato, Akira Uehara, Muneo Nakayama | 1988-06-07 |
| D291413 | Wafer holding frame | Akira Uehara, Hisashi Nakane, Muneo Nakayama | 1987-08-18 |
| 4578559 | Plasma etching method | Akira Uehara, Hisashi Nakane | 1986-03-25 |
| 4550242 | Automatic plasma processing device and heat treatment device for batch treatment of workpieces | Akira Uehara, Hisashi Nakane, Muneo Nakayama | 1985-10-29 |
| 4550239 | Automatic plasma processing device and heat treatment device | Akira Uehara, Hisashi Nakane, Muneo Nakayama | 1985-10-29 |
| 4483651 | Automatic apparatus for continuous treatment of leaf materials with gas plasma | Hisashi Nakane, Akira Uehara, Shigekazu Miyazaki, Hiroyuki Kiyota | 1984-11-20 |
| 4465553 | Method for dry etching of a substrate surface | Akira Uehara, Hisashi Nakane | 1984-08-14 |
| 4318767 | Apparatus for the treatment of semiconductor wafers by plasma reaction | Akira Uehara, Hisashi Nakane | 1982-03-09 |