Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9962915 | Bonding method and bonding apparatus | Yoshihiro Inao, Shigeru Kato, Takahiro Setaka, Shingo Ishida | 2018-05-08 |
| 9406542 | Retention device and retention method | — | 2016-08-02 |
| 9010343 | Cleaning device, cleaning method, and composition | — | 2015-04-21 |
| 8931535 | Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate | Akihiko Nakamura, Yoshihiro Inao | 2015-01-13 |
| 8882930 | Method for processing process-target object | — | 2014-11-11 |
| 8882096 | Perforated support plate | Akihiko Nakamura, Yoshihiro Inao, Yasumasa Iwata | 2014-11-11 |
| 8720456 | Processing apparatus fluid-processing a process target body | — | 2014-05-13 |
| 8449691 | Liquid solvent abutment unit | Akihiko Nakamura, Yoshihiro Inao, Yasumasa Iwata | 2013-05-28 |
| 8425713 | Bonding apparatus, method for preventing dissolving of adhesive agent, and bonding method | Satoshi Ohya | 2013-04-23 |
| 8426543 | Adhesive composition and adhesive film | Takahiro Asai, Koichi Misumi, Yoshihiro Inao, Akihiko Nakamura | 2013-04-23 |
| 8357750 | Adhesive composition and film adhesive | Koki Tamura, Takahiro Asai, Hirofumi Imai, Takahiro Yoshioka | 2013-01-22 |
| 8186410 | Separating device | Akihiko Nakamura, Junichi Katsuragawa, Yoshihiro Inao, Yasumasa Iwata | 2012-05-29 |
| 8167687 | Method of thinning wafer and support plate | Akihiko Nakamura, Yoshihiro Inao, Yasumasa Iwata | 2012-05-01 |
| 8163836 | Adhesive composition and adhesive film | Koichi Misumi, Ken Miyagi, Yoshihiro Inao | 2012-04-24 |
| 8148457 | Adhesive composition and film adhesive | Takahiro Asai, Koichi Misumi, Yoshihiro Inao, Akihiko Nakamura | 2012-04-03 |
| 8136564 | Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate | Akihiko Nakamura, Yoshihiro Inao | 2012-03-20 |
| 8097087 | Method of cleaning support plate | Tatsuhiro Mitake, Yoshihiro Inao | 2012-01-17 |
| 8080123 | Supporting plate, apparatus and method for stripping supporting plate | Akihiko Nakamura, Yoshihiro Inao | 2011-12-20 |
| 7999052 | Process for producing an adhesive composition | Takahiro Asai, Koichi Misumi, Yoshihiro Inao, Akihiko Nakamura, Koji Saito | 2011-08-16 |
| 7919394 | Method for thinning substrate and method for manufacturing circuit device | Akihiko Nakamura, Yoshihiro Inao | 2011-04-05 |
| 7849905 | Stripping device and stripping apparatus | Akihiko Nakamura, Yoshihiro Inao | 2010-12-14 |
| D552565 | Supporting plate | Akihiko Nakamura, Yoshihiro Inao | 2007-10-09 |
| 7268061 | Substrate attaching method | Kosuke Doi, Ken Miyagi, Yoshihiro Inao, Koichi Misumi | 2007-09-11 |
| D544452 | Supporting plate | Akihiko Nakamura, Yoshihiro Inao | 2007-06-12 |
| 7211168 | Substrate supporting plate and stripping method for supporting plate | — | 2007-05-01 |