TS

Takahiro Setaka

TC Tokyo Ohka Kogyo Co.: 1 patents #437 of 684Top 65%
Overall (All Time): #2,888,380 of 4,157,543Top 70%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9962915 Bonding method and bonding apparatus Atsushi Miyanari, Yoshihiro Inao, Shigeru Kato, Shingo Ishida 2018-05-08