YI

Yasumasa Iwata

TC Tokyo Ohka Kogyo Co.: 15 patents #82 of 684Top 15%
Overall (All Time): #295,037 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
10607876 Method for processing mold material and method for manufacturing structural body Yasushi Fujii, Akihiko Nakamura, Shingo Ishida 2020-03-31
9881829 Adhesive composition, laminate, and stripping method Takahiro Yoshioka, Koki Tamura, Hirofumi Imai, Atsushi Kubo, Shingo Ishida 2018-01-30
9682541 Bonding method Hirofumi Imai, Atsushi Kubo, Takahiro Yoshioka, Kimihiro Nakada, Shigeru Kato 2017-06-20
9627235 Supporting member separation method Yoshihiro Inao, Akihiko Nakamura, Shinji Takase, Takahiro Yoshioka 2017-04-18
9607875 Adhesive composition, laminate, and stripping method Takahiro Yoshioka, Koki Tamura, Hirofumi Imai, Atsushi Kubo, Shingo Ishida 2017-03-28
9484238 Attachment method Yoshihiro Inao, Shigeru Kato, Yasushi Fujii 2016-11-01
9129999 Treatment device, treatment method, and surface treatment jig Akihiko Nakamura 2015-09-08
8882096 Perforated support plate Akihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao 2014-11-11
8449691 Liquid solvent abutment unit Akihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao 2013-05-28
8377256 Stripping device and stripping method Kimihiro Nakada, Akihiko Nakamura, Yoshihiro Inao, Satoshi Kobari 2013-02-19
8371317 Surface treatment apparatus 2013-02-12
8302651 Stripping device and stripping method Kimihiro Nakada, Akihiko Nakamura, Yoshihiro Inao, Satoshi Kobari 2012-11-06
8297331 Separating apparatus and separating method Yoshihiro Inao, Akihiko Nakamura 2012-10-30
8186410 Separating device Akihiko Nakamura, Junichi Katsuragawa, Atsushi Miyanari, Yoshihiro Inao 2012-05-29
8181660 Treatment liquid permeation unit and treating apparatus Akihiko Nakamura, Junichi Katsuragawa 2012-05-22
8167687 Method of thinning wafer and support plate Akihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao 2012-05-01