Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12212094 | Connector | Yasuhiro Yamaguchi, Hiroshi Fujita, Toshiharu Takahashi, Hiroyuki Tanaka, Kazuki Shirosaka +1 more | 2025-01-28 |
| 12187356 | Vehicular aerodynamic device | Yukihide Shibutani | 2025-01-07 |
| 11949196 | Braided part connection structure | Kazuma Watanabe, Yasuhiro Yamaguchi | 2024-04-02 |
| 11764492 | Connection structure of press-clamping terminal and cable | Yasuhiro Yamaguchi | 2023-09-19 |
| 11721916 | Connection structure of bus bar and cable | Kazuma Watanabe, Yasuhiro Yamaguchi | 2023-08-08 |
| 11705656 | Connecter terminal structure | Masahiro Nakagawa, Syoichi Nomura, Yasuhiro Yamaguchi | 2023-07-18 |
| 11155312 | Movable spoiler device | Tokuhiro Shiga, Taishi Hashimoto, Yukihide Shibutani | 2021-10-26 |
| 11139161 | Method of processing substrates and substrate processing apparatus | Yoshinori Suzuki | 2021-10-05 |
| 11052954 | Vehicular straightening device | Tokuhiro Shiga, Yukihide Shibutani | 2021-07-06 |
| 11040744 | Spoiler device | Tokuhiro Shiga, Yukihide Shibutani | 2021-06-22 |
| 10651077 | Etching method | — | 2020-05-12 |
| 10625792 | Movable front spoiler device | Tokuhiro Shiga, Yukihide Shibutani | 2020-04-21 |
| 9530666 | Plasma etching method and plasma etching apparatus | Kumiko Yamazaki | 2016-12-27 |
| 8815106 | Method of supplying etching gas and etching apparatus | Masahiro Ogasawara, Yoshiyuki Kato, Yoshinobu Hayakawa | 2014-08-26 |
| 7905516 | Airbag module with integrated gas generation | William Bostick, James P. Karlow, Dave McCormick, Barney J. Bauer, Henk B. Helleman +2 more | 2011-03-15 |
| 7300881 | Plasma etching method | Kazuya Kato, Katsuhiko Ono, Masahiro Ogasawara, Akinori Kitamura, Noriyuki Kobayashi +2 more | 2007-11-27 |
| 6834885 | Inflator | Kanji Yano | 2004-12-28 |
| 6805376 | Inflator with shock wave generator | — | 2004-10-19 |
| 6576178 | Resin sealing apparatus and resin sealing method | Kiyomitsu Ishimura | 2003-06-10 |
| 6084310 | Semiconductor device, lead frame, and lead bonding | Mitsunori Kanemoto | 2000-07-04 |
| 6077757 | Method of forming chip semiconductor devices | Kazunao Tokunaga | 2000-06-20 |
| 6018189 | Lead frame for face-down bonding | — | 2000-01-25 |
| 4196387 | Apparatus for measuring output DC current of rectifier devices | Isao Watabe | 1980-04-01 |