Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343398 | BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail | Zhuowen Sun, Kyong-Mo Bang | 2016-05-17 |
| 9337170 | Contact arrangements for stackable microelectronic package structures | Zhuowen Sun, Kyong-Mo Bang | 2016-05-10 |
| 9281296 | Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design | Zhuowen Sun, Kyong-Mo Bang | 2016-03-08 |
| 9241420 | In-package fly-by signaling | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2016-01-19 |
| 9070423 | Single package dual channel memory with co-support | Richard Dewitt Crisp, Belgacem Haba, Wael Zohni, Zhuowen Sun | 2015-06-30 |
| 8723329 | In-package fly-by signaling | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2014-05-13 |