| 12311441 |
Method for manufacturing a multi-material part by additive manufacturing, using the technique of powder bed selective laser melting or selective laser sintering |
Frédéric Veron, Philippe Tailhades, Valérie Baco-Carles, Kateryna Kiryukhina |
2025-05-27 |
| 12126525 |
Redundancy matrix-based system |
Thomas J. Robe, Thierry Adam, Benjamin Therond |
2024-10-22 |
| 11258147 |
Assembly comprising a sleeve connecting first and second hollow waveguides, wherein grooves for receiving reversible deformable elements therein are located waveguides and sleeve |
Bertrand Brevart, Gilbert Fouctiere, Stéphane Forestier, Didier Dupuy, Brandon Grant |
2022-02-22 |
| 10340567 |
Microwave switching device with the state of the connections of the inputs and outputs being read by telemetry |
Raoul Rodriguez, Pierre-Yves Chabaud, Dominique Potuaud, Jérôme Battut, Johann Bornet +3 more |
2019-07-02 |
| 9232631 |
Hyperfrequency interconnection device |
David Nevo, Antoine Renel, Beatrice Espana |
2016-01-05 |
| 9108277 |
Process for manufacturing a device comprising brazes produced from metal oxalate |
Lidwine Raynaud, Valérie BACO, Michel Gougeon, Hoa LE TRONG, Philippe Tailhades |
2015-08-18 |
| 8850698 |
Method for the sealed assembly of an electronic housing |
Claude Drevon, Walim Ben Naceur |
2014-10-07 |
| 6754405 |
Electronic assembly having high interconnection density |
Marc Huan, Sylvain Paineau |
2004-06-22 |
| 6730997 |
Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device |
Eric Beyne, Augustin Coello-Vera |
2004-05-04 |
| 6683373 |
Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby |
Norbert Venet, Philippe Calvel, Stéphane Albinet, Jean-Cyril Esther, Marc Huan |
2004-01-27 |