Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6683373 | Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby | Olivier Vendier, Norbert Venet, Philippe Calvel, Stéphane Albinet, Marc Huan | 2004-01-27 |