Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10664423 | Digital processing device with high connectivity and incoming/outgoing throughput embedded aboard a space platform and split up into mutually interconnected modular processing islets which are remote from one another on the scale of the platform | Hélène Gachon | 2020-05-26 |
| 6748645 | Method of obtaining a module including an inductive winding | Claude Drevon, Stéphane Albinet | 2004-06-15 |
| 6683373 | Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby | Olivier Vendier, Philippe Calvel, Stéphane Albinet, Jean-Cyril Esther, Marc Huan | 2004-01-27 |