Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5327327 | Three dimensional assembly of integrated circuit chips | Dean L. Frew, Mark A. Kressley, Arthur M. Wilson, Juanita G. Miller, Philip Hecker +2 more | 1994-07-05 | $5,061,000 |