Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7301222 | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages | Viraj A. Patwardhan, Nikhil Kelkar | 2007-11-27 |
| 7253078 | Method and apparatus for forming an underfill adhesive layer | Luu Thanh Nguyen, Viraj A. Patwardhan, Nikhil Kelkar, Shahram Mostafazadeh | 2007-08-07 |
| 6973225 | Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package | Luu Thanh Nguyen, Ken Pham, Peter Deane, William Paul Mazotti, Bruce Carlton Roberts +4 more | 2005-12-06 |