Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465274 | Lead frame tooling design for bleed barrier groove | Dennis D. Davis | 2002-10-15 |
| 6401765 | Lead frame tooling design for exposed pad features | Dennis D. Davis | 2002-06-11 |
| 6365976 | Integrated circuit device with depressions for receiving solder balls and method of fabrication | Dennis D. Davis, David R. Kee, Richard E. Johnson | 2002-04-02 |
| 6365980 | Thermally enhanced semiconductor ball grid array device and method of fabrication | Dennis D. Davis, David R. Kee, Richard E. Johnson | 2002-04-02 |
| 6211462 | Low inductance power package for integrated circuits | Dennis D. Davis | 2001-04-03 |
| 6072230 | Exposed leadframe for semiconductor packages and bend forming method of fabrication | Jesse E. Clark, David R. Kee | 2000-06-06 |
| 5905308 | Bond pad for integrated circuit | Taylor R. Efland, Charles E. Williams | 1999-05-18 |
| 5663597 | RF device package for high frequency applications | Stephen R. Nelson, Dennis D. Davis, Tammy Lahutsky, John Barnett, Glen R. Haas, Jr. | 1997-09-02 |
| 5594234 | Downset exposed die mount pad leadframe and package | Dennis D. Davis, David R. Kee, Jesse E. Clark, Steven P. Laverde, Hai Tran | 1997-01-14 |
| 5376909 | Device packaging | Stephen R. Nelson, Tammy Lahutsky, Glen R. Haas, Jr., Dennis D. Davis, Charles W. Suckling +1 more | 1994-12-27 |