| 6365976 |
Integrated circuit device with depressions for receiving solder balls and method of fabrication |
Buford H. Carter, Jr., Dennis D. Davis, Richard E. Johnson |
2002-04-02 |
| 6365980 |
Thermally enhanced semiconductor ball grid array device and method of fabrication |
Buford H. Carter, Jr., Dennis D. Davis, Richard E. Johnson |
2002-04-02 |
| 6072230 |
Exposed leadframe for semiconductor packages and bend forming method of fabrication |
Buford H. Carter, Jr., Jesse E. Clark |
2000-06-06 |
| 5715989 |
Microelectronic wire bonding using friction welding process |
— |
1998-02-10 |
| 5594234 |
Downset exposed die mount pad leadframe and package |
Buford H. Carter, Jr., Dennis D. Davis, Jesse E. Clark, Steven P. Laverde, Hai Tran |
1997-01-14 |
| 5545846 |
Laser bond header |
Charles E. Williams, Dennis D. Davis |
1996-08-13 |
| 5308797 |
Leads for semiconductor chip assembly and method |
— |
1994-05-03 |
| 5070039 |
Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal |
Richard E. Johnson, Dennis D. Davis, John W. Orcutt, Angus W. Hightower |
1991-12-03 |