Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365976 | Integrated circuit device with depressions for receiving solder balls and method of fabrication | Buford H. Carter, Jr., Dennis D. Davis, Richard E. Johnson | 2002-04-02 |
| 6365980 | Thermally enhanced semiconductor ball grid array device and method of fabrication | Buford H. Carter, Jr., Dennis D. Davis, Richard E. Johnson | 2002-04-02 |
| 6072230 | Exposed leadframe for semiconductor packages and bend forming method of fabrication | Buford H. Carter, Jr., Jesse E. Clark | 2000-06-06 |
| 5715989 | Microelectronic wire bonding using friction welding process | — | 1998-02-10 |
| 5594234 | Downset exposed die mount pad leadframe and package | Buford H. Carter, Jr., Dennis D. Davis, Jesse E. Clark, Steven P. Laverde, Hai Tran | 1997-01-14 |
| 5545846 | Laser bond header | Charles E. Williams, Dennis D. Davis | 1996-08-13 |
| 5308797 | Leads for semiconductor chip assembly and method | — | 1994-05-03 |
| 5070039 | Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal | Richard E. Johnson, Dennis D. Davis, John W. Orcutt, Angus W. Hightower | 1991-12-03 |