Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6072230 | Exposed leadframe for semiconductor packages and bend forming method of fabrication | Buford H. Carter, Jr., David R. Kee | 2000-06-06 |
| 5594234 | Downset exposed die mount pad leadframe and package | Buford H. Carter, Jr., Dennis D. Davis, David R. Kee, Steven P. Laverde, Hai Tran | 1997-01-14 |