Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9596754 | Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate | Gento Iwayama, Arata Endo, Shoji Minegishi | 2017-03-14 |
| 9497856 | Laminated structure, dry film and method of producing laminated structure | Daichi Okamoto, Shoji Minegishi | 2016-11-15 |
| 9423691 | Layered structure and photosensitive dry film to be used therefor | Takahiro Yoshida, Shouji Minegishi | 2016-08-23 |
| 9310680 | Photocurable/thermosetting resin composition | Nobuhito Ito | 2016-04-12 |
| 9188871 | Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof | Arata Endo, Shoji Minegishi | 2015-11-17 |
| 9091921 | Layered structure and photosensitive dry film to be used therefor | Takahiro Yoshida, Shouji Minegishi | 2015-07-28 |
| 9068100 | Thermosetting resin composition, cured product thereof, and printed wiring board using the same | Arata Endo, Nobuhito Ito | 2015-06-30 |
| 8962712 | Photosensitive resin composition, dry film thereof, and printed wiring board using them | Nobuhito Ito, Kazuyoshi YONEDA | 2015-02-24 |
| 8765831 | Photocurable resin composition | Shoji Minegishi | 2014-07-01 |
| 8748502 | Photocurable resin composition | Yoko Shibasaki | 2014-06-10 |
| 8722816 | Solder resist, dry film thereof, cured product, and printed wiring board | Nobuaki Otsuki, Manabu Akiyama, Shouji Minegishi | 2014-05-13 |
| 8642234 | Photosensitive resin, curable resin composition containing the same, dry film thereof, and printed circuit board using them | Nobuhito Ito, Syouji Nishiguchi, Kouji Ogawa, Masayuki Kobayashi, Atsushi Sakamoto | 2014-02-04 |
| 8101336 | Photocurable and thermosetting resin composition, cured product thereof, and printed circuit board | Nobuhito Itoh, Yoko Shibasaki, Kenji Kato | 2012-01-24 |
| 8048613 | Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same | Nobuhito Itoh, Yoko Shibasaki, Kenji Kato | 2011-11-01 |
| 7838197 | Photosensitive composition | Yoko Shibasaki, Kenji Kato | 2010-11-23 |
| 7825198 | Thermosetting resin composition and multilayer printed wiring board using the same | Makoto Hayashi, Koshin Nakai | 2010-11-02 |
| 7648814 | Black paste composition, method of forming black matrix pattern by using the same, and the black matrix pattern formed | Masaki Sasaki, Kenji Kato | 2010-01-19 |
| 7517632 | Silver paste composition, method of forming conductive pattern by using the same, and the conductive pattern formed | Masaki Sasaki, Kenji Kato | 2009-04-14 |
| 6177490 | Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof | Kyoichi Yoda, Akio Sekimoto, Norio Kimura, Masashi Sugita | 2001-01-23 |
| 5948514 | Photocurable thermosettting resin composition developable with aqueous alkali solution | Shigeru Komori, Kazuo Suda, Miyako Juni | 1999-09-07 |
| 5741622 | One-package photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof | — | 1998-04-21 |