Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9423691 | Layered structure and photosensitive dry film to be used therefor | Takahiro Yoshida, Masao Arima | 2016-08-23 |
| 9091921 | Layered structure and photosensitive dry film to be used therefor | Takahiro Yoshida, Masao Arima | 2015-07-28 |
| 8722816 | Solder resist, dry film thereof, cured product, and printed wiring board | Nobuaki Otsuki, Manabu Akiyama, Masao Arima | 2014-05-13 |
| 8492070 | Photocurable and thermosetting resin composition and printed circuit boards made by using the same | Hideaki Kojima, Hidekazu Miyabe, Naoki Yoneda, Yoshitaka Hirai | 2013-07-23 |