Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9891523 | Photosensitive dry film and process for producing printed wiring board using the same | Daichi Okamoto, Nobuhito Ito | 2018-02-13 |
| 9596754 | Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate | Gento Iwayama, Arata Endo, Masao Arima | 2017-03-14 |
| 9497856 | Laminated structure, dry film and method of producing laminated structure | Daichi Okamoto, Masao Arima | 2016-11-15 |
| 9388308 | Curable resin composition, composition for forming solder resist, dry film and printed wiring board, and laminate and process for preparing the same | Daichi Okamoto | 2016-07-12 |
| 9298096 | Curable resin composition, cured product thereof, printed circuit board comprising the same, and method for producing the cured product | Kazuya Okada, Shuichi Yamamoto, Daichi Okamoto, Xiaozhu WEI | 2016-03-29 |
| 9265156 | Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured film | Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto | 2016-02-16 |
| 9188871 | Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof | Arata Endo, Masao Arima | 2015-11-17 |
| 8765831 | Photocurable resin composition | Masao Arima | 2014-07-01 |
| 7718714 | Resin curable with actinic energy ray, photocurable and thermosetting resin composition containing the same, and cured product obtained therefrom | — | 2010-05-18 |