Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6916873 | Liquid thermosetting resin composition, printed wiring boards and process for their production | Rieko Yamamoto, Norio Kimura, Yasukazu Watanabe | 2005-07-12 |
| 6618933 | Liquid thermosetting insulating resin composition and method for permanently filling holes in printed circuit board by the use thereof | Rieko Yamamoto | 2003-09-16 |
| 6177490 | Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof | Akio Sekimoto, Norio Kimura, Masashi Sugita, Masao Arima | 2001-01-23 |