Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363459 | Photosensing pixel including self-aligned light shielding layer | Chih-Chiang Chang, Chia-Chan Chen | 2025-07-15 |
| 12113079 | Image sensor with shallow trench edge doping | Chia-Chan Chen | 2024-10-08 |
| 12046614 | Apparatus and methods for effective impurity gettering | Shih-Hsien Huang, Chia-Chan Chen, Pu Chen | 2024-07-23 |
| 11735609 | Image sensor with shallow trench edge doping | Chia-Chan Chen | 2023-08-22 |
| 11158591 | Bond pad structure for bonding improvement | Chia-Chan Chen | 2021-10-26 |
| 11139212 | Semiconductor arrangement and method for making | Chia-Chan Chen | 2021-10-05 |
| 11133340 | Device comprising photodiode and method of making the same | Chia-Chan Chen, Ta-Hsin Chen, Shih-Hsien Huang, Chih-Huang Li | 2021-09-28 |
| 10998360 | Image sensor with shallow trench edge doping | Chia-Chan Chen | 2021-05-04 |
| 10998359 | Image sensor with shallow trench edge doping | Chia-Chan Chen | 2021-05-04 |
| 10879123 | Protected chip-scale package (CSP) pad structure | Chia-Chan Chen, Ching-Heng Liu | 2020-12-29 |
| 10734339 | Bond pad structure for bonding improvement | Chia-Chan Chen | 2020-08-04 |
| 10714516 | Image sensor with shallow trench edge doping | Chia-Chan Chen | 2020-07-14 |
| 10672810 | CMOS image sensor with shallow trench edge doping | Chia-Chan Chen | 2020-06-02 |
| 10515989 | Device comprising photodiode and method of making the same | Chia-Chan Chen, Ta-Hsin Chen, Shih-Hsien Huang, Chih-Huang Li | 2019-12-24 |
| 10510606 | Protected chip-scale package (CSP) pad structure | Chia-Chan Chen, Ching-Heng Liu | 2019-12-17 |
| 10276524 | Bond pad structure for bonding improvement | Chia-Chan Chen | 2019-04-30 |
| 10276441 | Protected chip-scale package (CSP) pad structure | Chia-Chan Chen, Ching-Heng Liu | 2019-04-30 |
| 10170517 | Method for forming image sensor device | Ta-Hsin Chen, Chia-Chan Chen, Chih-Huang Li, Ren-Jie Lin, Jung-I Lin | 2019-01-01 |
| 10163952 | Backside illuminated image sensor device structure | Chia-Chan Chen, Chih-Huang Li, Ta-Hsin Chen | 2018-12-25 |
| 10014269 | Method for wafer dicing | Chia-Chan Chen | 2018-07-03 |
| 9859325 | Complementary metal-oxide-semiconductor (CMOS) image sensor with silicon and silicon germanium | Chia-Chan Chen, Jhy-Jyi Sze | 2018-01-02 |
| 9761623 | Backside illuminated (BSI) image sensor with a reflector | Chia-Chan Chen | 2017-09-12 |
| 9748290 | Mechanisms for forming image sensor with lateral doping gradient | Tzo-Hung Luo | 2017-08-29 |
| 9748150 | Test line structure and method for performing wafer acceptance test | Chia-Chan Chen, Ping-Chieh Chin | 2017-08-29 |
| 9748187 | Wafer structure and method for wafer dicing | Chia-Chan Chen | 2017-08-29 |