CL

Ching-Heng Liu

TSMC: 4 patents #4,745 of 12,232Top 40%
Overall (All Time): #1,094,275 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
12408461 Semiconductor structure with isolation structure Chang Yu Kuo, Ya-Wen Wu 2025-09-02
10879123 Protected chip-scale package (CSP) pad structure Yueh-Chuan Lee, Chia-Chan Chen 2020-12-29
10510606 Protected chip-scale package (CSP) pad structure Yueh-Chuan Lee, Chia-Chan Chen 2019-12-17
10276441 Protected chip-scale package (CSP) pad structure Yueh-Chuan Lee, Chia-Chan Chen 2019-04-30