Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408456 | Image sensor pixel and metal shielding of charge storage device of image sensor pixel formed by one step process | Cheng-Yen Li, Meng-Chin Lee | 2025-09-02 |
| 12363459 | Photosensing pixel including self-aligned light shielding layer | Yueh-Chuan Lee, Chih-Chiang Chang | 2025-07-15 |
| 12317639 | Optical sensing device having inclined reflective surface | Chih-Chiang Chang | 2025-05-27 |
| 12300713 | Image sensor having lens layer over optical sensing area and manufacturing method thereof | — | 2025-05-13 |
| 12218260 | Optical sensing device having inclined reflective surface | Chih-Chiang Chang | 2025-02-04 |
| 12113079 | Image sensor with shallow trench edge doping | Yueh-Chuan Lee | 2024-10-08 |
| 12046614 | Apparatus and methods for effective impurity gettering | Yueh-Chuan Lee, Shih-Hsien Huang, Pu Chen | 2024-07-23 |
| 11735609 | Image sensor with shallow trench edge doping | Yueh-Chuan Lee | 2023-08-22 |
| 11728362 | Image sensor pixel and metal shielding of charge storage device of image sensor pixel formed by one step process | Cheng-Yen Li, Meng-Chin Lee | 2023-08-15 |
| 11552205 | Optical sensing device having inclined reflective surface | Chih-Chiang Chang | 2023-01-10 |
| 11398512 | Photo-sensing device and manufacturing method thereof | — | 2022-07-26 |
| 11380729 | Image sensor having lens layer and manufacturing method thereof | — | 2022-07-05 |
| 11158591 | Bond pad structure for bonding improvement | Yueh-Chuan Lee | 2021-10-26 |
| 11139212 | Semiconductor arrangement and method for making | Yueh-Chuan Lee | 2021-10-05 |
| 11133340 | Device comprising photodiode and method of making the same | Yueh-Chuan Lee, Ta-Hsin Chen, Shih-Hsien Huang, Chih-Huang Li | 2021-09-28 |
| 10998360 | Image sensor with shallow trench edge doping | Yueh-Chuan Lee | 2021-05-04 |
| 10998359 | Image sensor with shallow trench edge doping | Yueh-Chuan Lee | 2021-05-04 |
| 10879123 | Protected chip-scale package (CSP) pad structure | Yueh-Chuan Lee, Ching-Heng Liu | 2020-12-29 |
| 10734339 | Bond pad structure for bonding improvement | Yueh-Chuan Lee | 2020-08-04 |
| 10714516 | Image sensor with shallow trench edge doping | Yueh-Chuan Lee | 2020-07-14 |
| 10672810 | CMOS image sensor with shallow trench edge doping | Yueh-Chuan Lee | 2020-06-02 |
| 10515989 | Device comprising photodiode and method of making the same | Yueh-Chuan Lee, Ta-Hsin Chen, Shih-Hsien Huang, Chih-Huang Li | 2019-12-24 |
| 10510606 | Protected chip-scale package (CSP) pad structure | Yueh-Chuan Lee, Ching-Heng Liu | 2019-12-17 |
| 10276524 | Bond pad structure for bonding improvement | Yueh-Chuan Lee | 2019-04-30 |
| 10276441 | Protected chip-scale package (CSP) pad structure | Yueh-Chuan Lee, Ching-Heng Liu | 2019-04-30 |